Mechanical properties of UV-curable polyurethane acrylate used in packaging of MEMS devices

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 384-390

  Tey, J N ^a,b   Soutar, A M ^b   Mhaisalkar, S G ^a   Yu, H ^a   Hew, K M ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^c HEWLETT PACKARD COMPANY   (United States)

Author keywords

Material characterization; Polyurethane acrylate; UV encapsulant

Indexed keywords

CORROSION; ELASTIC MODULI; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; MOISTURE; ULTRAVIOLET RADIATION;

MATERIAL CHARACTERIZATION; POLYURETHANE ACRYLATES; UV ENCAPSULANT;

POLYURETHANES;

EID: 33644922632     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.104     Document Type: Conference Paper

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