Modification of epoxy resins with polysiloxane thermoplastic polyurethane for electronic encapsulation: 1

Polymer

Volumn 37, Issue 13, 1996, Pages 2733-2742

  Ho, Tsung Han ^a   Wang, Chun Shan ^b  

^a NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Encapsulating materials; Epoxy resin; Polysiloxane TPU

Indexed keywords

CHEMICAL MODIFICATION; COMPOSITION EFFECTS; DISPERSIONS; ELASTIC MODULI; ELECTRONICS PACKAGING; ENCAPSULATION; MOLECULAR WEIGHT; POLYURETHANES; RING OPENING POLYMERIZATION; SILICONES; THERMAL EXPANSION; VISCOELASTICITY;

OXAZOLIDONE; POLYSILOXANE THERMOPLASTIC POLYURETHANE PARTICLES;

EPOXY RESINS;

EID: 0030165812     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/0032-3861(96)87635-X     Document Type: Article

References (24)

1. Kinjo, N., Ogata, M., Nishi, K. and Kaneda, A. 'Advances in Polymer Science', Springer-Verlag, Berlin, 1989, Vol. 88
2. Kuwata, K., Iko, K. and Tabata, H. IEEE Trans. Comp. Hybrids Manuf. Technol. 1985, CHMT-8 (4), 486
3. Thomas, R. E. IEEE Trans. Comp. Hybrids Manuf. Technol. 1985, CHMT-8 (4), 427
4. Suhl, D. IEEE Trans. Comp. Hybrids Manuf. Technol. 1990, CHMT-13 (4), 940
5. Nakamura, Y., Uenishi, S., Kunishi, T., Miki, K., Tabata, H., Kuwada, K., Suzuki, H. and Matsumoto, T. IEEE Trans. Comp. Hybrids Manuf. Technol. 1987, CHMT-12 (4), 502
6. Nakamura, Y., Yamaguchi, M., Okubo, M. and Matsumoto, T. J. Appl. Polym. Sci. 1992, 45, 1281
7. Hoffman, D. K. and Arends, C. B. US Pat. 4708996 1987
8. Tyagi, D., Yilgor, I., McGrath, J. E. and Wilkes, G. L. Polymer 1984, 25, 1807
9. Ho, T. H. and Wang, C. S. J. Appl. Polym. Sci. 1993, 50, 477
10. Verchere, D., Pascault, J. P., Sautereau, H., Moschiar, S. M., Riccardi, C. C. and Williams, R. J. J. J. Appl. Polym. Sci. 1991, 42, 701
11. Verchere, D., Sautereau, H. and Pascault, J. P. J. Appl. Polym. Sci. 1990, 41, 467
12. Hourston, D. J. and Lane, J. M. Polymer 1992, 33 (7), 1379
13. Sankaran, S. and Chanda, M. J. Appl. Polym. Sci. 1990, 39, 1459
14. Sankaran, S. and Chanda, M. J. Appl. Polym. Sci. 1990, 39, 1635
15. Nakamura, Y., Uenishi, S., Kunishi, T., Miki, K., Tabata, H., Kuwada, K., Suzuki, H. and Matsumoto, T. IEEE 37th ECC Proceeding 1987, p. 187
16. Sultan, J. N. and McGarry, F. J. J.. Appl Polym. Sci. 1973, 13 (1), 29
17. Pearson, R. A. and Yee, A. F. J. Mater. Sci. 1986, 21, 2475
18. Kim, D. H. and Kin, S. C. J. Appl. Polym. Sci. 1991, 31 (5), 289
19. Ho, T. H. and Wang, C. S. J. Appl. Polym. Sci. 1994, 51, 2047
20. Ho, T. H. and Wang, C. S. J. Appl. Polym. Sci. 1994, 54, 13
21. Kojima, Y., Ohta, T., Matsushita, M., Takahara, M. and Kurauchi, T. J. Appl. Polym. Sci. 1990, 41, 2199
22. Yorkgitis, E. M., Eiss, N. S., Jr, Tran, C., Wilkes, G. L. and McGrath, J. E. 'Advances in Polymer Science', Springer-Verlag, New York, 1985, Vol. 72
23. Browning, C. E. Polym. Eng. Sci. 1978, 18 (1), 16
24. Kimura, H., Ohizumi, S., Nishioka, T., Nakao, M. and Harada, M. Proc. IEEE 1992, 1035