The effects of curing parameters on the properties development of an epoxy encapsulant material

Microelectronics Reliability

Volumn 42, Issue 1, 2002, Pages 119-125

  Naito, Christine ^a   Todd, Michael ^a  

^a Electronic Materials   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; GLASS TRANSITION; INTEGRATED CIRCUITS; STRAIN; THERMAL EXPANSION;

EPOXY ENCAPSULANT MATERIALS;

ENCAPSULATION;

EID: 0036133635     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00126-3     Document Type: Article

References (7)

1. Measurement of backside flip chip die stresses using piezoresistive test die
2. Low stress encapsulants for reduced failures in plastic packages
3. Glass-transition temperature-conversion relationship for an epoxy-hexahydro-4-methylphthalic anhydride system
4. Study of rapid cure BGA mold compound on warpage with shadow moire
5. Liquid encapsulation application considerations
6. A new epoxy based liquid encapsulant with perfomance comparable to mold compounds