Effect of plasma process on low-k material and barrier layer performance

Thin Solid Films

Volumn 504, Issue 1-2, 2006, Pages 248-251

  Chen, X T ^a   Gui, D ^a   Mo, Z Q ^c   Du, A Y ^a   Chi, D Z ^b   Wang, W D ^b   Wang, Y H ^a   Lu, D ^a   Tang, L J ^a   Li, W H ^a   Wong, L Y ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^c PSB Corporation   (Singapore)

Author keywords

Barrier layer; Cu diffusion; Cu low k; Plasma treatment

Indexed keywords

ANNEALING; OPTICAL INTERCONNECTS; PLASMA APPLICATIONS; SURFACE CHEMISTRY;

BARRIER LAYER; CU DIFFUSION; CU/LOW-K; PLASMA TREATMENT;

DIELECTRIC MATERIALS;

EID: 33644908748     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.160     Document Type: Conference Paper

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