Lead contamination of a transient liquid-phase-processed Sn-Bi lead-free solder paste

Journal of Electronic Materials

Volumn 35, Issue 2, 2006, Pages 284-291

  Whitney, M ^a   Corbin, S F ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Differential calorimetry; Sn Bi; Solder paste

Indexed keywords

DIFFERENTIAL CALORIMETRY; SN-BI; SOLDER PASTE;

BISMUTH; CONTAMINATION; DIFFERENTIAL SCANNING CALORIMETRY; LEAD; SOLIDIFICATION;

TIN;

EID: 33644897066     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692448     Document Type: Conference Paper

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