Grain boundary and triple junction chemistry of silicon carbide with aluminum or aluminum nitride additive

Ceramic Transactions

Volumn 178, Issue , 2006, Pages 91-102

  Pabit, Edgardo ^a   Crane, Samantha ^a   Seiben, Kerry ^a   Butt, Darryl P ^a   Ray, Darin ^b   Marc Flinders, R ^b   Cutler, Raymond A ^b  

^a University of Florida   (United States)

^b CERAMATEC INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERGRANULAR FRACTURE; TRANSGRANULAR FRACTURE; TRIPLE GRAIN JUNCTIONS; TRIPLE JUNCTION CHEMISTRY;

ADDITIVES; ALUMINUM; ALUMINUM NITRIDE; GRAIN BOUNDARIES; SINTERING; TRANSMISSION ELECTRON MICROSCOPY;

SILICON CARBIDE;

EID: 33644792473     PISSN: 10421122     EISSN: None     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

References (26)

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