Transient conjugate heat-transfer model for circular tubes inside a rectangular substrate

Journal of Thermophysics and Heat Transfer

Volumn 20, Issue 1, 2006, Pages 122-134

  Rao, P S C ^a,b   Rahman, Muhammad M ^a,c  

^a UNIVERSITY OF SOUTH FLORIDA   (United States)

^b Department of Mechanical Engineering ^*  (United States)

^c AIAA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLANTS; FINITE ELEMENT METHOD; HEAT CONDUCTION; LAMINAR FLOW; NUSSELT NUMBER; PRANDTL NUMBER; SILICON; SILICON CARBIDE; TUBES (COMPONENTS);

CIRCULAR MICROTUBE; POWER STARTUP; RECTANGULAR SUBSTRATE; TRANSIENT HEAT TRANSFER;

HEAT TRANSFER;

COOLANTS; FINITE ELEMENT METHOD; HEAT CONDUCTION; HEAT TRANSFER; LAMINAR FLOW; NUSSELT NUMBER; PRANDTL NUMBER; SILICON; SILICON CARBIDE; TUBES (COMPONENTS);

EID: 32844464044     PISSN: 08878722     EISSN: 15336808     Source Type: Journal    
DOI: 10.2514/1.12496     Document Type: Article

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