Transient response of microchannel heat sinks in a silicon wafer

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 4, 1997, Pages 239-246

  Rujano, J R ^a   Rahman, M M ^a  

^a University of South Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HEAT CONVECTION; HEAT SINKS; LAMINAR FLOW; NUSSELT NUMBER; REYNOLDS NUMBER; SEMICONDUCTING INDIUM PHOSPHIDE; SEMICONDUCTING SILICON; THERMAL CONDUCTIVITY OF SOLIDS;

MICROCHANNEL HEAT SINKS; TRANSIENT ENERGY EQUATION;

SILICON WAFERS;

EID: 0031343277     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792243     Document Type: Article

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