Raised floor computer data center: Effect on rack inlet temperatures of chilled air exiting both the hot and cold aisles

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 580-594

  Schmidt, Roger ^a   Cruz, Ethan ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR CONDITIONING; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; DATA PROCESSING; TEMPERATURE DISTRIBUTION;

COMPUTER DATA CENTERS;

THERMAL LOAD;

EID: 0036455474     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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8. Quivey, B., and Bailey, A.M., "Cooling of Large Computer Rooms - Design and Construction of ASCI10 TeraOps", Interpack99, June 1999, Maui, Hawaii.
9. Schmidt, R., "Thermal Management of Office Data Processing Centers", Advances in Electronic Packaging 1997(Proceedings of The Pacific Rim/ASME International Electronic Packaging Technical Conference, INTERpack '97), Vol. 2, EEP-Vol 19-2, Kohala Coast, Hawaii, June 15-19, 1997, pp. 1995-2010.
10. Seymour, M., "Dynamic Design on Atria", Building Services, January, 1992, pp. 27-29.
11. Kang, S., Schmidt, R., Kelkar, K., Patankar, S., "A Methodology for the Design of Perforated Tiles in Raised Floor Data Centers Using Computational Flow Analysis", IEEE-CPMT Journal, Vol. 24, No. 2, pp. 177-183, June 2001.
12. Schmidt, R., Karki, K., Kelkar, K., Radmehr, A., Patankar, S., "Measurements and Predictions of the Flow Distribution through Perforated Tiles in Raised Floor Data Centers", Advances in Electronic Packaging 2001 (Proceedings of IPACK '01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Vol. 2, Paper IPACK2001-15728, Kauai, Hawaii, July 8-13, 2001, pp. 905-914.
13. Flotherm Instruction Manual, Flomerics Ltd, U.K.