Techniques for controlling airflow distribution in raised-floor data centers

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 621-628

  Karki, Kailash C ^a   Patankar, Suhas V ^a   Radmehr, Amir ^a  

^a Innovative Research Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR CONDITIONING; COMPUTATIONAL FLUID DYNAMICS; COOLING; FLOORS; HARDWARE; HEAT TRANSFER; MATHEMATICAL MODELS; PRESSURE DISTRIBUTION; RETROFITTING; TILE; ELECTRONICS PACKAGING; HEATING;

AIRFLOW RATES; COMPUTER ROOM AIR CONDITIONER (CRAC); DATA CENTERS; FLOW RATES; AIR FLOW-RATE; AIRFLOW DISTRIBUTION; COMPUTER SERVERS; FLOOR SPACE; HEAT LOADS;

FLUID DYNAMICS; SATELLITE COMMUNICATION SYSTEMS;

EID: 1242264346     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35282     Document Type: Conference Paper

References (9)

1. Innovative Research, Inc., 2001, TileFlow: A Simulation Tool for Airflow Distribution in Raised-Floor Data Centers.
2. Kang, S., Schmidt, R. R., Kelkar, K. M., Radmehr, A., and Patankar, S. V., 2001, A Methodology for the Design of Perforated Tiles in Raised Floor Data Centers Using Computational Flow Analysis. IEEE Transactions on Components and Packaging Technologies, 24(2), pp. 177-183.
3. Schmidt, R. R., Karki, K. C., Kelkar, K. M., Radmehr, A., and Patankar, S. V., 2001, "Measurements and Predictions of the Flow Distribution Through Perforated Tiles in Raised-Floor Data Centers," Paper No. IPACK2001-15728, Proceedings of InterPack'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, July 8-13, 2001, Kauai, Hawaii, USA.
4. Karki, K. C., Radmehr, A., and Patankar, S. V., 2003, "Use of Computational Fluid Dynamics for Calculating Flow Rates Through Perforated Tiles in Raised-Floor Data Centers," to appear in International Journal of HVAC&R Research.
5. Schmidt, R., 2001, "Effect of Data Center Characteristics on Data Processing Equipment Inlet Temperatures," Paper No. IPACK2001-15870, Proceedings of InterPack'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, July 8-13, 2001, Kauai, Hawaii, USA.
6. Schmidt, R., and Cruz, E., 2002, "Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures of Chilled Air Exiting Both the Hot and Cold Aisles," IEEE 2002 Inter Society Conference on Thermal Phenomena, pp. 580-594.
7. Patel, C. D., Sharma, R., Bash, C. E. and Beitelmal, A., 2002, "Thermal Considerations in Cooling Large Scale High Compute Data Centers," ITHERM 2002, The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
8. Launder, B. E. and Spalding, D. B., 1974, "The Numerical Computation of Turbulent Flows," Computer Methods in Applied Mechanics and Engineering, 3, pp. 269-289.
9. Patankar, S.V., 1980, Numerical Heat Transfer and Fluid Flow, Taylor and Francis.