Internal stress in Cat-CVD microcrystalline Si:H thin films

Thin Solid Films

Volumn 501, Issue 1-2, 2006, Pages 117-120

  Sahu, Laxmi ^a   Kale, Nitin ^a   Kulkarni, Nilesh ^b   Pinto, R ^a   Dusane, R O ^a   Schroder B ^c  

^a INDIAN INSTITUTE OF TECHNOLOGY BOMBAY   (India)

^b TATA INSTITUTE OF FUNDAMENTAL RESEARCH   (India)

^c Rheinland Pfälzische Technische Universität Kaiserslautern Landau   (Germany)

Author keywords

Grain size; Residual stress; X ray diffraction

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; CRYSTALLINE MATERIALS; GRAIN SIZE AND SHAPE; RESIDUAL STRESSES; X RAY DIFFRACTION;

DOPED FILMS; INTERNAL STRESS; STRESS DETERMINATION;

THIN FILMS;

EID: 32644454149     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.07.136     Document Type: Conference Paper

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