Reliability and failure analyses of thermally cycled ball grid array assemblies

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 3, 2000, Pages 528-534

  Ghaffarian, Reza ^a   Kim, Namsoo P ^b  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; FAILURE ANALYSIS; POLYIMIDES; RELIABILITY; THERMAL CYCLING; THERMOANALYSIS;

CERAMIC BALL GRID ARRAYS (CBGA); PLASTIC BALL GRID ARRAYS (PBGA);

ELECTRONICS PACKAGING;

EID: 0034273667     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.868853     Document Type: Article

References (3)

1. R. Ghaffarian and N. Kim, "Ball grid reliability assessment for aerospace applications," in Proc. 30th Int. Symp. Microelectron., Philadelphia, PA, Oct. 1997, pp. 396-400.
2. R. Ghaffarian, "CBGA/PBGA package planarity and assembly reliability," in Proc. 1997 Int. Flip Chip, Ball Grid Array, TAB Adv. Packag. Symp., Feb. 17-19, 1997.
3. J. Lau, Ed., Ball Grid Array Technology. New York: McGraw-Hill, 1995.