Steady state thermal characterization and junction temperature estimation of multichip module packages using the response surface method

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 1, 2000, Pages 33-39

  Zahn, Bret A ^a  

^a ChipPAC Incorporated   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; COOLING; ELECTRONICS PACKAGING; HEAT CONVECTION; HEAT RESISTANCE; LINEAR EQUATIONS; POLYNOMIALS; SEMICONDUCTOR JUNCTIONS; SENSITIVITY ANALYSIS; THERMOANALYSIS;

PLASTIC BALL GRID ARRAYS (PBGA); RESPONSE SURFACE METHODS;

MULTICHIP MODULES;

EID: 0033877494     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.833039     Document Type: Article

References (12)

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