Using a cryogenic aerosol process to clean copper, low-k materials without damage

MICRO

Volumn 20, Issue 2, 2002, Pages 23-28

  Butterbaugh, Jeffery W ^a  

^a Surface Conditioning Division   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 3242661729     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. JJ Wu et al, "Wafer Cleaning with Cryogenic Argon Aerosols, " Semiconductor International 19, no. 9 (1996): 113-118.
2. JF Weygand et al., "Cleaning Silicon Wafers with an Argon/Nitrogen Cryogenic Aerosol Process, " MICRO 15, no. 4 (1997): 47-54.
3. JW Butterbaugh et al., "Enhancing Yield through Argon/Nitrogen Cryokinetic Aerosol Cleaning after Via Processing, " MICRO 17, no. 6 (1999): 33-43.
4. N Narayanswami, "On the Generation of Cryogenic Aerosols for Wafer Processing, " in Cleaning Technology in Semiconductor Device Manufacturing V, ECS Proceedings Series 97-35 (Pennington, NJ: The Electrochemical Society, 1997), 357-364.
5. N Narayanswami, "A Theoretical Analysis of Wafer Cleaning Using a Cryogenic Aerosol, " Journal of the Electrochemical Society 146, no. 2, (1999): 767-774.
6. N Narayanswami, "Thermophoresis Assisted Cryogenic Aerosol Cleaning of Wafers, " in Cleaning Technology in Semiconductor Device Manufacturing V, ECS Proceedings Series 97-35 (Pennington, NJ: The Electrochemical Society, 1997), 350-356.
7. Y Homma et al., "Control of Photocorrosion in the Copper Damascene Process, " Journal of the Electrochemical Society 147, no. 3 (2000): 1193-1198.
8. A Beverina et al., "Copper Photocorrosion Phenomenon during Post CMP Cleaning, " Electrochemical Solid-State Letters 3, no. 3 (2000): 156-158.
9. B Kirkpatrick et al., "CryoKinetic Cleaning on Cu/Low-k Dual Damascene Structures" (paper presented at the Electrochemical Society Conference, San Francisco, September 6, 2001).