Stress reduction behavior in metal-incorporated amorphous carbon films: First-principles approach

Journal of Physics: Conference Series

Volumn 29, Issue 1, 2006, Pages 155-158

  Choi, J H ^a   Ahn, H S ^a   Lee, S C ^a   Lee, K R ^a  

^a Korea Institute of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 32144451546     PISSN: 17426588     EISSN: 17426596     Source Type: Conference Proceeding    
DOI: 10.1088/1742-6596/29/1/029     Document Type: Conference Paper

References (11)

1. Fan X, Dickey E C, Pennycook S J and Sunkara M K 1999 Appl. Phys. Lett 75 2740
2. Zhang P, Tay B K, Sun C Q and Lau S P 2002 J. Vac. Sci. Tech. A 20 1390
3. Shi B, Meng W J, Rehn L E and Baldo P M 2002 Appl. Phys. Lett 81 352
4. Corbella C, Vives M, Pinyol A, Bertran E, Canal C, Polo M C and Andujar J L 2004 Surf. Coat.Tech 177 409
5. Voevodin A A, O'Neill J P, Prasad S V and Zabinski J S 1999 J. Vac. Sci. Tech. A 17 986
6. Lee C S, Lee K-R, Eun K Y, Yoon K H and Han J H 2002 Diam. Relat. Mater 11 198
7. Wang Ai-Ying, Ahn H-S, Lee K-R and Ahn J-P 2005 Appl. Phys. Lett 86 111902
8. Delley B 1990 J. Chem. Phys 92 508
9. Perdew J P, Burke K and Ernzerhof M 1996 Phys. Rev. Lett 77 3865
10. McKenzie D R, Muller D and Pailthorpe B A 1991 Phys. Rev. Lett 67 773
11. Lee S-H, Lee S-C and Lee K-R private communication