Effect of wafer-scale shape variations and mounting in wafer bonding

Proceedings - Electrochemical Society

Volumn PV 2005-02, Issue , 2005, Pages 270-279

  Turner, K T ^a   Spearing, S M ^b   Hester, P ^c   Sinha, J ^c   Baylies, W A ^d  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b UNIVERSITY OF SOUTHAMPTON   (United Kingdom)

^c ADE Corporation   (United States)

^d Bay Tech Group   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; MACHINE TOOLS; PROCESS CONTROL; RESIDUAL STRESSES; SILICON WAFERS;

BONDING TOOLS; ELEMENT MECHANICS; WAFER BONDING; WAFER PAIRS;

BONDING;

EID: 31844442096     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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8. K.T. Turner and S.M. Spearing, J. Appl Phys., 92, 7658 (2002).