Fabrication of micro probe beam using MEMS technology for new vertical silicon probe card

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 7 B, 2005, Pages 5759-5763

  Kim, Young Min ^a   Yoon, Ho Cheol ^a   Seo, Chang Taeg ^b   Lee, Jong Hyun ^b  

^a Special Business Division   (South Korea)

^b Kyungpook National University   (South Korea)

Author keywords

Micro probe beam; Porous silicon micromachining; Radius of curvature; Thermal expansion coefficient

Indexed keywords

ELECTROPLATING; FINITE ELEMENT METHOD; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MULTILAYERS; PROBES; REACTIVE ION ETCHING; SILICON; THERMAL EXPANSION;

MICRO PROBE BEAM; POROUS SILICON MICROMACHINING; RADIUS OF CURVATURE; THERMAL EXPANSION COEFFICIENT;

ION BEAMS;

EID: 31844436832     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.44.5759     Document Type: Article

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