Fabrication of a silicon micro-probe for vertical probe card application

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 37, Issue 12 B, 1998, Pages 7070-7073

  Kim, Yong Dae ^a   Sim, Jun Hwan ^b   Nam, Jae Woo ^a   Lee, Jong Hyun ^c  

^a Lumsonic Co Ltd   (South Korea)

^b Korea Maritime University   (South Korea)

^c Kyungpook National University   (South Korea)

Author keywords

Cantilever tips; Contact resistance; Porous silicon micromachining; Probe card; Surface tension; Thermal expansion coefficient

Indexed keywords

EID: 0347806137     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.7070     Document Type: Article

References (8)

1. C. Barsotti. S. Tremaine and M. Bonham: Proc IEEE Int. Testing Conf. (1988) p. 608.
2. Ron Iscoff: Semicond. Int. (1994) June p. 76.
3. Mark Beiley, Justin Leung and S. Simon Wong: IEEE Trans. Components, Packaging & Manufactur. Tech. B 13 (1995) 179.
4. T. Tada et al: Proc. 1990 Intern. Test Conf. (1990) p. 900.
5. J. Kiester and R. Franch: Proc. IEEE Int. Testing Conf. (1988) p. 608.
6. X. Z. Tu: J. Electrochem. Soc. 135 (1988) 2105.
7. C. J. M. Eijkel, J. Branebjerg, M. Elwenspoek and F. C. M. Van de Pol: IEEE Electron Device Lett. 11 (1990) 588.
8. W. Lang, P. Steiner and H. Sandmaier: Sensors & Actuators A 51 (1995) 31.