De-embedding transmission line measurements for accurate modeling of IC designs

IEEE Transactions on Electron Devices

Volumn 53, Issue 2, 2006, Pages 235-241

  Mangan, Alain M ^a   Voinigescu, Sorin P ^a   Yang, Ming Ta ^b   Tazlauanu, Mihai ^c  

^a UNIVERSITY OF TORONTO   (Canada)

^b TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^c Quake Technologies Inc   (Canada)

Author keywords

Characterization; De embedding; Deep submicrometer technologies; Integrated circuits; Interconnect; Losses; Microstrip lines; Slotted ground planes; Transmission lines

Indexed keywords

ELECTRIC LINES; ELECTRIC VARIABLES MEASUREMENT; MATHEMATICAL MODELS; MICROSTRIP LINES; OPTICAL INTERCONNECTS; PERMITTIVITY; SEMICONDUCTOR DEVICE MODELS;

DE-EMBEDDING TRANSMISSION LINE; DEEP SUBMICROMETER TECHNOLOGIES; SLOTTED GROUND PLANES;

CMOS INTEGRATED CIRCUITS;

EID: 31744441107     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2005.861726     Document Type: Article

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