|
Volumn 222, Issue 3-4, 2004, Pages 462-468
|
Explanation of the enhancement of NiSi thermal stability according to TFD equations and Miedema's model
|
Author keywords
Heat of formation; Nickel silicide; Thermal stability
|
Indexed keywords
ANNEALING;
CMOS INTEGRATED CIRCUITS;
ENTROPY;
EVAPORATION;
SUBSTRATES;
THERMODYNAMIC STABILITY;
X RAY DIFFRACTION ANALYSIS;
HEAT OF FORMATION;
NICKEL SILICIDES;
SHEET RESISTANCE;
THOMAS-FERMI-DIRAC (TFD) EQUATIONS;
NICKEL COMPOUNDS;
|
EID: 3142751208
PISSN: 0168583X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.nimb.2004.02.023 Document Type: Article |
Times cited : (8)
|
References (20)
|