Evaluation of film biaxial modulus and coefficient of thermal expansion from thermoelastic film stress measurements

Journal of Applied Physics

Volumn 95, Issue 12, 2004, Pages 7892-7897

  Thurn, Jeremy ^a   Hughey, Michael P ^b  

^a SEAGATE TECHNOLOGY   (United States)

^b UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIAXIAL MODULUS; DOUBLE-SUBSTRATE TECHNIQUES; FILM STRESS; TEMPERATURE DEPENDENT;

DATA REDUCTION; DILATOMETERS; ELASTIC MODULI; ELECTROPLATING; ERROR ANALYSIS; FUSED SILICA; LEAST SQUARES APPROXIMATIONS; PARAMETER ESTIMATION; POISSON DISTRIBUTION; POLYCRYSTALLINE MATERIALS; POLYNOMIAL APPROXIMATION; REGRESSION ANALYSIS; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EXPANSION; THERMOELASTICITY;

METALLIC FILMS;

EID: 3142533271     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1753662     Document Type: Article

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