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Volumn 12, Issue 3, 2006, Pages 187-192

High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA process

Author keywords

Aspect ratio; Current density; Electroforming; HARM; Ion concentration

Indexed keywords

ASPECT RATIO; CATHODES; CURRENT DENSITY; MATHEMATICAL MODELS; METAL ANALYSIS; MICROSTRUCTURE;

EID: 31144451099     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-005-0050-6     Document Type: Article
Times cited : (20)

References (12)
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  • 4
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  • 5
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    • High aspect ratio structures obtained by electroforming in microstructured glass
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  • 7
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    • New microelectrodes for the investigation of the electroforming of LIGA microstructures
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  • 8
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    • High-aspect-ratio microstructure filling by centrifugal force field modeling
    • Tsai TH et al (2004a) High-aspect-ratio microstructure filling by centrifugal force field modeling. Microsyst Technol 10:571-577
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  • 10
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    • New electroforming technology pressure id for LIGA process
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  • 11
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    • A tertiary current distribution model for the pulse plating of copper into high aspect ratio sub-0.25 μm trenches
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.