Ultrasonic wire-bond quality monitoring using piezoelectric sensor

Sensors and Actuators, A: Physical

Volumn 65, Issue 1, 1998, Pages 69-75

  Or, S W ^a,b   Chan, H L W ^a   Lo, V C ^a   Yuen, C W ^b  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

Bond quality; PZT piezoelectric sensors; Second harmonic; Ultrasonic wire bond quality monitoring techniques; Ultrasonic wire bonding transducers

Indexed keywords

CERAMIC MATERIALS; FREQUENCY RESPONSE; LEAD COMPOUNDS; PIEZOELECTRIC DEVICES; PROCESS CONTROL; QUALITY CONTROL; SECOND HARMONIC GENERATION; SENSORS; SIGNAL DETECTION;

PIEZOELECTRIC SENSORS; ULTRASONIC WIRE BOND QUALITY MONITORING TECHNIQUES;

ULTRASONIC TRANSDUCERS;

EID: 0032002326     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)01638-5     Document Type: Article

References (24)

1. B. Langenecker, Effects of ultrasound on deformation characteristics of metals, IEEE Trans. Sonics Ultrasonics, SU-13 (1996) 1-8.
2. G.G. Harman and J. Albers, The ultrasonic welding mechanism as applied to aluminum and gold wire bonding in microelectronics, EEEE Trans. Hybrids Packaging, PHP-13 (1977) 406-412.
3. K.C. Joshi, The formation of ultrasonic bonds between metals, Welding J., 50 (1977) 840-848.
4. J.L. Harthoorn, Ultrasonic metal welding, Ph.D. Thesis, Technical Hogeschool, Eindhoven, The Netherlands, 1978.
5. R. Rodwell and D.A. Worrall, Quality control in ultrasonic wire bonding, Hybrid Circuits, No. 7 (May) (1985) 67-72.
6. E.G. Konovalov and V.S. Galkov, Acoustic emission recording as a mean of investigating solid-state welding process, Welding Production, 9 (1972) 82-85.
7. J.B. Jones, Sonobond Corporation, Vibratory welding process and apparatus, US Patent No. 3 056 192 (Oct. 1962).
8. J.H. Cusick, United States Navy, Ultrasonic bond monitor, US Patent No. 3 890 831 (June 1975).
9. J.L. Landes, Texas Instruments Inc., Ultrasonic bond energy monitor, US Patent No. 4 341 574 (July 1982).
10. M. McBrearty, M. Negin, A. Zielenski and M. Weilerstein, Real time non-destructive evaluation in ultrasonic wire bonding, Proc. IEEE Ultrasonics Symp., Atlanta, GA, USA, Nov. 1983, Vol. 2, pp. 861-865.
11. M.J. Hight, R.V. Winkle and J.R. Dale, Mullard Ltd., Improvements in and relating to ultrasonic bonding apparatus, British Patent No. 1506 164 (Apr. 1978).
12. H. Tsukahara, M. Nakashima and T. Sugawara, Automated visual inspection system for bonded IC wires, Microelectronics J., 24 (1993) 625-633.
13. R. Pufall, Automatic process control of wire bonding, Proc. 43rd Electronic Components Technol. Conf., Orlando. FL, USA, June 1993, pp. 159-162.
14. S.W. Or, H.L.W. Chan, V.C. Lo and C.W. Yuen, Sensors for automatic process control of wire bonding, to appear in Proc. 10th IEEE Int. Symp. Applications of Ferroelectrics (ISAF), East Brunswick, NJ, USA, Aug. 1996, Vol. 2, pp. 991-994.
15. S.W. Or, H.L.W. Chan, V.C. Lo and C.W. Yuen, Dynamics of an ultrasonic transducer used for wire bonding, submitted to IEEE Trans. Ultrasonics, Ferroelectrics Freq. Control.
16. IEEE Standard on Piezoelectricity, IEEE Std. 176, Institute of Electrical and Electronics Engineers, Inc., 1978.
17. IRE Standards on Piezoelectric Crystals: Measurements of Piezoelectric Ceramics, Proc. IRE. 49 (1961) 1161-1169.
18. Five Modern Piezoelectric Ceramics, Vernitron Ltd., UK, 1988.
19. D. Royer and V. Kmetik, Measurement of piezoelectric constants using an optical heterodyne interferometer, Electron. Lett., 28 (1992) 1828-1830.
20. D. Royer and E. Dieulesaint, Optical probing of the mechanical impulse response of a transducer, Appl. Phys. Lett., 49 (1986) 1056-1058.
21. C. Alfaro, Semiconductor assembly variables - their impact in the interconnection process, Verity Instruments Inc., TX, USA, 1993.
22. G.G. Harman, The microelectronic ball-bond shear test - a critical review and comprehensive guide to its use, Int. J. Hybrid Microelectron., 6 (1983) 127-141.
23. Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds, ASTM Std. F 459-84, Annual Book of ASTM Standards, Vol. 10.04.
24. Test Methods for Destructive Shear Testing of Ball Bonds, ASTM Std. F 1269-89, Annual Book of ASTM Standards, Vol. 10.04.