Correlation of defects on dielectric surfaces with large particle counts in chemical-mechanical planarization (CMP) slurries using a new single particle optical sensing (SPOS) technique

Materials Research Society Symposium Proceedings

Volumn 867, Issue , 2005, Pages 57-62

  Remsen, Edward E ^a   Anjur, Sriram P ^a   Boldridge, David ^a   Kamiti, Mungai ^a   Li, Shoutian ^a  

^a CABOT MICROELECTRONICS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DIELECTRIC MATERIALS; POLYSTYRENES; SENSORS; SILICA; SLURRIES;

MODEL SLURRIES; SINGLE PARTICLE OPTICAL SENSING METHOD (SPOS); SURFACE FILMS;

CRYSTAL DEFECTS;

EID: 30544455510     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-867-w4.2     Document Type: Conference Paper

References (9)

1. J.M. Steigerwald, S.P. Murarka, and R.J. Gutmann, Chemical-Mechanical Planarization of Microelectronic Materials (John-Wiley & Sons, New York, 1997) pp. 36 and 281.
2. Y. Ahn, J-Y. Yoon, C-W. Baek, and Y-K. Kim, Wear 257, 785 (2004).
3. R. Singh and R. Bajaj, MRS Bulletin 27, 743 (2002).
4. L. Anthony, J. Miner, M. Baker, W. Lai, J. Sowell, A. Maury, and Y. Obeng, Proc. Electrochem. Soc. 8, 181 (1998).
5. T. Kuntzsch, U. Witnik, M. Hollatz, M. Stintz, and S. Ripperger, Chem. Eng. Tech. 12, 1235 (2003).
6. D. Nicoli, P. O'Hagan, G. Pokrajac and K. Hasapidis, Amer. Lab. 32, 18 (2000).
7. L.H. Hanus, S.A. Battafarano, and A.R. Wank, MICRO 21, 71 (2003).
8. J.P. Bare and T.A. Lemke, MICRO 15, 53 (1997).
9. th CMP-MIC Conference, pp. 221-224, (2003).