The effect of additives in post-Cu CMP cleaning on particle adhesion and removal

Journal of the Electrochemical Society

Volumn 151, Issue 11, 2004, Pages

  Hong, Yi Koan ^a   Eom, Dae Hong ^a   Lee, Sang Ho ^a   Kim, Tae Gon ^a   Park, Jin Goo ^a   Busnaina, Ahmed A ^b  

^a Hanyang University   (South Korea)

^b NORTHEASTERN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ADHESION; ADSORPTION; CONTAMINATION; ELECTROCHEMISTRY; ELECTROSTATICS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; REDUCTION;

ABRASIVE PARTICLES; CHEMICAL MECHANICAL PLANARIZATION (CMP); RESISTANCE-CAPACITANCE (RC); ZETA POTENTIALS;

COPPER;

EID: 10944264681     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1802493     Document Type: Article

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