Resistivity-temperature behavior of dilute Cu(Ir) and Cu(W) alloy films

Journal of Materials Research

Volumn 20, Issue 12, 2005, Pages 3391-3396

  Barmak, Katayun ^a   Cabral, Jr ^b   Kellock, A J ^c   Harper, J M E ^d  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c IBM ALMADEN RESEARCH CENTER   (United States)

^d University of New Hampshire   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DEPOSITION; DISSOLUTION; ELECTRIC CONDUCTIVITY; FILMS; PRECIPITATION (CHEMICAL);

BINARY PHASE DIAGRAMS; RESISTIVITY-TEMPERATURE BEHAVIOR; SOLUTE REDISSOLUTION;

COPPER ALLOYS;

EID: 30444434708     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2005.0416     Document Type: Article

References (12)

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9. A. Gungor: Cu and Cu-alloy thin films: Evolution of resistivity and microstructure. Ph.D. Thesis, Carnegie Mellon University, Pittsburgh, PA (2002).
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11. D.B. Butrymowicz, J.R. Manning, and M.E. Read: International Copper Research Association Monograph V. The Metallurgy of Copper. Diffusion Rate Data and Mass Transport Phenomena for Copper Systems (National Bureau of Standards, Washington, DC, 1977).
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