High conductivity copper-boron alloys obtained by low temperature annealing

Journal of Electronic Materials

Volumn 30, Issue 1, 2001, Pages L1-L5

  Zhang, S L ^a,b   Harper, J M E ^a   D'Heurle, F M ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ELECTRIC CONDUCTIVITY; PRECIPITATION (CHEMICAL); THERMAL EFFECTS;

RAMP RATES;

COPPER ALLOYS;

EID: 0035151776     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0215-8     Document Type: Article

References (10)

1. See, for example, Mater. Res. Soc. Bulletin 19 (1994).
2. J.M.E. Harper and K.P. Rodbell, J. Vac. Sci. Technol. B15, 763 (1997); J.M.E. Harper, C. Cabral Jr., P.C. Andricacos, L. Gignac, I.C. Noyan, K.P. Rodbell, and C.K. Hu, J. Appl. Phys. 86, 2516 (1999).
3. J.M.E. Harper and K.P. Rodbell, J. Vac. Sci. Technol. B15, 763 (1997); J.M.E. Harper, C. Cabral Jr., P.C. Andricacos, L. Gignac, I.C. Noyan, K.P. Rodbell, and C.K. Hu, J. Appl. Phys. 86, 2516 (1999).
4. T.B. Massalski, editor, Binary Alloy Phase Diagrams (Materials Park, OH: ASM Int. 1990), pp. 474, 1486.
5. S. Hymes, K.S. Kumar, S.P. Murarka, W. Wang, and W.A. Lanford, Mater. Res. Soc. Symp. Proc. 428, 17 (1996).
6. J.M.E. Harper, L.A. Clevenger, E.G. Colgan, C. Cabral, Jr., and B.P. Arcot, Mater. Res. Soc. Symp. Proc. 318, 307 (1994).
7. S.-L. Zhang and F. M. d'Heurle, Thin Solid Films 256, 155 (1995).
8. K. Barmak, G.A. Lucadamo, C. Cabral, Jr., C. Lavoie, and J.M.E. Harper, J. Appl. Phys. 87, 2204 (2000).
9. D.B. Butrymowicz, Diffusion Rate Data and Mass Transport Phenomena for Copper Systems - Part II (Washington, D.C.: Diffusion in Metals Data Center, Metallurgy Division, Institute for Materials Research, National Bureau of Standards, 1981), p. 174.
10. D.B. Butrymowicz, J.R. Manning, and M.E. Read, Diffusion Rate Data and Mass Transport Phenomena for Copper Systems (Washington, D.C.: Diffusion in Metals Data Center, Metallurgy Division, Institute for Materials Research, National Bureau of Standards, 1981), pp. 19, 145.