Bulk micromachined vibratory lateral gyroscope fabricated with wafer bonding and deep trench etching

Sensors and Actuators, A: Physical

Volumn 83, Issue 1, 2000, Pages 24-29

  Li, Zhihong ^a   Yang, Zhenchuan ^a   Xiao, Zhixiong ^a   Hao, Yilong ^a   Li, Ting ^a   Wu, Guoying ^a   Wang, Yangyuan ^a  

^a PEKING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; ETCHING; GLASS BONDING; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SILICON WAFERS; VIBRATIONS (MECHANICAL);

DEEP TRENCH ETCHING; VIBRATORY LATERAL GYROSCOPE;

GYROSCOPES;

EID: 0033741711     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00375-1     Document Type: Article

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