Pattern alignment effects in through-wafer bulk micromachining of (100) silicon

IEEE Workshop on Microelectronics and Electron Devices, WMED: IEEE Electron Devices Northwest Regional Meeting

Volumn , Issue , 2004, Pages 89-92

  Reddy, P Srikar ^a   Jessing, Jeffrey R ^a  

^a Boise State University   (United States)

Author keywords

Orientation dependent etching; Silicon bulk micromachining

Indexed keywords

CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; ETCHING; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; PROFILOMETRY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SUBSTRATES;

ALIGNMENT ERRORS; ORIENTATION DEPENDENT ETCHING; SILICON BULK MICROMACHINING; WET ETCHING;

SEMICONDUCTING SILICON;

EID: 3042615957     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Chen, Ping-Hei; Hsieh, Chia-Ming; Peng, Hsin-Yah, and Chyu, Minking "Precise mask alignment design to crystal orientation of (100) silicon wafer using wet anisotropic etching," Micromachining and microfabrication process technology, vol. 4174, pp.462-466, December 2000.
2. Lu Li, Taechung Yi, and Chang-Jin "CJ" Kim "Effect of mask-to-crystal direction misalignment on fracture strength of silicon microbeam," Proc. Microscale Systems: Mechanics and Measurements Symp., Society for Experimental Mechanics, IX International Congress, Orlando, FL, pp. 36-40, June 2000.
3. T.Yi, L. Li and C.-J. Kim, "Microscale Material Testing of Single Crystalline Silicon: Process Effects on Surface Morphology and Tensile Strength," Sensors and Actuators, A Physical, Vol. 83, pp. 172-178, May 2000.
4. R. Edwin Oosterbroek, J. W. (Erwin) Berenschot, Henri V. Jansen, A. Jasper Nijdam, Grégory Pandraud, Albert van den Berg, and Miko C. Elwenspoek "Etching Methodologies in <111> -Oriented Silicon Wafers," Journal of Microelectromechanical Systems, Vol.9, pp. 390-398, September 2000.