Fault Isolation of High Resistance Defects using Comparative Magnetic Field Imaging

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 2003-November, Issue , 2003, Pages 9-13

  Orozco, Antonio ^a   Talanova, Elena ^a   Gilbertson, Anders ^a   Knauss, L A ^a   Wang, Zhiyong ^b   Skoglund, Lars ^b   Smith, David G ^b   Dias, Rajen ^b  

^a Neocera Inc   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROSTRIP LINES;

CURRENT IMAGING; FAULT ISOLATION; HIGH RESISTANCE DEFECTS; INTEGRATED CIRCUIT PACKAGE; INTERCONNECT STRUCTURES; LOCALISATION; MAGNETIC FIELD IMAGING; PACKAGE STRUCTURE; SIGNAL LINES; TIME DOMAIN REFLECTOMETRY;

MAGNETIC FIELDS;

EID: 10444275502     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa2003p0009     Document Type: Conference Paper

References (3)

1. D. T. Searls, D. Anura, E. Dy, and D. Goyal, Time Domain Reflectometry as a Device Packaging Level Failure Analysis and Failure Localization Tool, ISTFA 2000
2. R. Dias, L Skoglund, Z. Wang, and D. Smith, Integration of SQUID microscopy into FA flow, ISTFA 2001.
3. D. Vallett, Scanning SQUID Microscopy for die level fault isolation, ISTFA 2002