-
1
-
-
0036072909
-
Advanced passive devices for enhanced integrated RF circuit performance
-
June
-
D. Coolbaugh, E. Eshun, R. Groves, D. Harame, J. Johnson, M. Hammad, Z. He, V. Ramachandran, K Stein, S. St Onge, S. Subbanna, D. Wang, R. Volant, X. Wang, K. Watson; "Advanced Passive Devices For Enhanced Integrated RF Circuit Performance", IEEE: Microwave Symposium Digest, P187-190, Vol.1, No.2-7, June, 2002.
-
(2002)
IEEE: Microwave Symposium Digest
, vol.1
, Issue.2-7
, pp. 187-190
-
-
Coolbaugh, D.1
Eshun, E.2
Groves, R.3
Harame, D.4
Johnson, J.5
Hammad, M.6
He, Z.7
Ramachandran, V.8
Stein, K.9
St Onge, S.10
Subbanna, S.11
Wang, D.12
Volant, R.13
Wang, X.14
Watson, K.15
-
2
-
-
0024646931
-
Development and evaluation of a GaAs MMIC phase-locked loop chip set for space applications
-
April
-
J. Archer, B. Smith, G. Weaver, H. Wong, J. Yonemura; "Development and Evaluation of a GaAs MMIC Phase-Locked Loop Chip Set for Space Applications", IEEE Transactions on Microwave Theory and Techniques, P790-792, Vol.37, No.4, April 1989.
-
(1989)
IEEE Transactions on Microwave Theory and Techniques
, vol.37
, Issue.4
, pp. 790-792
-
-
Archer, J.1
Smith, B.2
Weaver, G.3
Wong, H.4
Yonemura, J.5
-
3
-
-
0033334327
-
Stress-buffer and passivation processes for Si and GaAs IC's and passive componenets using photosenstive BCB: Process technology and reliability data
-
Aug.
-
P. Garrou, W. Rogers, D. Scheck, A. Strandjord, Y Ida, and Kaoru Ohba; "Stress-Buffer and Passivation Processes for Si and GaAs IC's and Passive Componenets Using Photosenstive BCB: Process Technology and Reliability Data", IEEE Transactions on Advanced Packaging, P487-498, Vol.22, No.3, Aug. 1999.
-
(1999)
IEEE Transactions on Advanced Packaging
, vol.22
, Issue.3
, pp. 487-498
-
-
Garrou, P.1
Rogers, W.2
Scheck, D.3
Strandjord, A.4
Ida, Y.5
Ohba, K.6
-
4
-
-
0036776550
-
xN thin films
-
Oct.
-
xN Thin Films", Microelectron. Eng. (Netherlands), P289-297, Vol.64, No. 1-4 Oct. 2002.
-
(2002)
Microelectron. Eng. (Netherlands)
, vol.64
, Issue.1-4
, pp. 289-297
-
-
Riekkinen, T.1
Molarius, J.2
Laurila, T.3
Nurmela, A.4
Suni, I.5
Kivilahti, J.K.6
-
5
-
-
3042560616
-
3) and resistive (TaN) films for distributed RC network
-
3) and resistive (TaN) films for distributed RC network", INTEGRATED FERROELECTRICS, P413-423, V37, N1-4, 2001.
-
(2001)
Integrated Ferroelectrics
, vol.37
, Issue.1-4
, pp. 413-423
-
-
Choi, W.Y.1
Trolier-McKinstry, S.2
-
6
-
-
0032312482
-
Thermal conductance of IC interconnects embedded in dielectrics
-
D. Harmon, J Gill, and T. Sullivan; "Thermal Conductance of IC Interconnects Embedded in Dielectrics", IRW Final Report, pp. 1-9, 1998.
-
(1998)
IRW Final Report
, pp. 1-9
-
-
Harmon, D.1
Gill, J.2
Sullivan, T.3
-
7
-
-
0033282166
-
Predicting thermal behavior of interconnects
-
J. Gill, D. Harmon, J. Furukawa, and T. Sullivan; "Predicting Thermal Behavior of Interconnects", IRW Final Report, pp.54-61, 1999.
-
(1999)
IRW Final Report
, pp. 54-61
-
-
Gill, J.1
Harmon, D.2
Furukawa, J.3
Sullivan, T.4
|