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Volumn , Issue , 2004, Pages 502-508

Characterization and reliability of TaN thin film resistors

Author keywords

[No Author keywords available]

Indexed keywords

BACK END OF THE LINE (BEOL); FRONT END OF THE LINE (FEOL); TEMPERATURE COEFFICIENT OF RESISTANCE (TCR); TEMPERATURE RISE VERSUS INPUT POWER (TVP);

EID: 3042522549     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (18)

References (10)
  • 3
    • 0033334327 scopus 로고    scopus 로고
    • Stress-buffer and passivation processes for Si and GaAs IC's and passive componenets using photosenstive BCB: Process technology and reliability data
    • Aug.
    • P. Garrou, W. Rogers, D. Scheck, A. Strandjord, Y Ida, and Kaoru Ohba; "Stress-Buffer and Passivation Processes for Si and GaAs IC's and Passive Componenets Using Photosenstive BCB: Process Technology and Reliability Data", IEEE Transactions on Advanced Packaging, P487-498, Vol.22, No.3, Aug. 1999.
    • (1999) IEEE Transactions on Advanced Packaging , vol.22 , Issue.3 , pp. 487-498
    • Garrou, P.1    Rogers, W.2    Scheck, D.3    Strandjord, A.4    Ida, Y.5    Ohba, K.6
  • 6
    • 0032312482 scopus 로고    scopus 로고
    • Thermal conductance of IC interconnects embedded in dielectrics
    • D. Harmon, J Gill, and T. Sullivan; "Thermal Conductance of IC Interconnects Embedded in Dielectrics", IRW Final Report, pp. 1-9, 1998.
    • (1998) IRW Final Report , pp. 1-9
    • Harmon, D.1    Gill, J.2    Sullivan, T.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.