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Volumn 16, Issue 1, 2000, Pages 55-64

Optimization of the substrate preheat temperature for the encapsulation of flip chip devices

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENCAPSULATION; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; OPTIMIZATION; PRINTED CIRCUIT MANUFACTURE; QUALITY ASSURANCE; STATISTICAL METHODS; SUBSTRATES; THERMAL EXPANSION;

EID: 0033886421     PISSN: 02683768     EISSN: None     Source Type: Journal    
DOI: 10.1007/PL00013134     Document Type: Article
Times cited : (9)

References (5)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.