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Volumn 16, Issue 1, 2000, Pages 55-64
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Optimization of the substrate preheat temperature for the encapsulation of flip chip devices
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRONICS PACKAGING;
ENCAPSULATION;
FLIP CHIP DEVICES;
INTEGRATED CIRCUIT MANUFACTURE;
MATHEMATICAL MODELS;
OPTIMIZATION;
PRINTED CIRCUIT MANUFACTURE;
QUALITY ASSURANCE;
STATISTICAL METHODS;
SUBSTRATES;
THERMAL EXPANSION;
DIRECT CHIP ATTACH;
FLIP CHIP ON BOARD (FCOB) TECHNOLOGIES;
SUBSTRATE PREHEAT TEMPERATURE;
COMPUTER INTEGRATED MANUFACTURING;
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EID: 0033886421
PISSN: 02683768
EISSN: None
Source Type: Journal
DOI: 10.1007/PL00013134 Document Type: Article |
Times cited : (9)
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References (5)
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