Stencil printing technology for 100μm flip chip bumping

Global SMT and Packaging

Volumn 4, Issue 2, 2004, Pages 10-14

  Manessis, D ^a,b   Patzelt, R ^a   Ostmann, A ^b  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

Flip chip bumping; Solder bump height; Stencil printing; Type 6 solder paste; Type 7 solder paste

Indexed keywords

FLIP CHIP BUMPING; SOLDER BUMP HEIGHT; STENCIL PRINTING; TYPE 6 SOLDER PASTE; TYPE 7 SOLDER PASTE;

ELECTROPLATING; ELECTROSTATIC PRINTING; EUTECTICS; EVAPORATION; MICROELECTRONICS; SEMICONDUCTOR DEVICES; SOLDERING ALLOYS; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THICKNESS MEASUREMENT; VISCOSITY; WSI CIRCUITS;

FLIP CHIP DEVICES;

EID: 2942724288     PISSN: 14740893     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. E. Vardaman. Growing demand for Flip Chip. Advancing Microelectronics, Jan/Feb.2003,pp.10-42.
2. A. Ostmann et al. "Electroless Metal Deposition for Back-End Wafer Processes", Advancing Microelectronics, pp. 23-26, May/June 1999.
3. J. Schake, "Stencil Printing for Wafer Bumping", Semiconductor International, pp. 1-8, October 2000.
4. P. Coskina et al. "Wafer Bumping for wafer-level CSP's and flip chips using Stencil printing technology", Proc. IMAPS Europe Conference, Harrogate, June 7-9, 1999.
5. P. Elenius, J. Leal, J. Ney, D. Stepniak, S. Yeh, "Recent Advances in Flip Chip Wafer Bumping using Solder paste Technology", Proc. 49th ECTC, San Diego, 1999.
6. B. Huang and N.C. Lee, "Solder Bumping via Paste Reflow for Array packages", Journal of Surface Mount Technology, Vol. 15, Issue 1, pp. 16-31, January-March 2002.
7. G. Meyer-Berg, "KGD Roadmapping", Good-Die & Europractice-HDP newsletter, No. 10, pp. 4-7, April 2001.
8. D. Manessis et al., "Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping", Proc. IMAPS International, Denver, Colorado, 2002, pp. 727-732.
9. G.J.Jackson et al., "Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb free solder pastes used for flip chip", Proc. ECTC, New Orleans, 2003, pp.536-543.