Electroless metal deposition for back-end wafer processes

Advancing Microelectronics

Volumn 26, Issue 3, 1999, Pages 23-26

  Ostmann, A ^a   Jauernig, Ch ^a   Dombrowski, Ch ^a   Kloeser, J ^a   Aschenbrenner, R ^a   Reichl, H ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; MICROELECTRONIC PROCESSING; SILICON WAFERS;

ELECTROLESS BUMPING;

ELECTROLESS PLATING;

EID: 0032643332     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)