-
1
-
-
0032594183
-
Copper wafer bonding
-
Fan, A., Rahman, A. and Reif, R., "Copper wafer bonding." Electrochemical and Solid-State Letters 2(10), pp. 534-536, 1999.
-
(1999)
Electrochemical and Solid-State Letters
, vol.2
, Issue.10
, pp. 534-536
-
-
Fan, A.1
Rahman, A.2
Reif, R.3
-
2
-
-
85013949634
-
Wire-length distribution of three-dimensional integrated circuits
-
Rahman, A., Fan, A., Chung, J. and Reif, R., "Wire-length distribution of three-dimensional integrated circuits," in Proceedings of IITC, pp. 233-235, 1999.
-
(1999)
Proceedings of IITC
, pp. 233-235
-
-
Rahman, A.1
Fan, A.2
Chung, J.3
Reif, R.4
-
3
-
-
33646125223
-
Interconnect performance modeling for 3D integrated circuits with multiple Si layers
-
Souri, S. J. and Saraswat, K. C., "Interconnect performance modeling for 3D integrated circuits with multiple Si layers," in Proceedings of IITC, pp. 24-26, 1999.
-
(1999)
Proceedings of IITC
, pp. 24-26
-
-
Souri, S.J.1
Saraswat, K.C.2
-
4
-
-
0022011363
-
The magic VLSI layout system
-
February
-
Ousterhout, J. K., Hamachi, G. T., Mayo, R. N., Scott, W. S. and Taylor, G. S., "The magic VLSI layout system." IEEE Design and Test, pp. 19-30, February 1985.
-
(1985)
IEEE Design and Test
, pp. 19-30
-
-
Ousterhout, J.K.1
Hamachi, G.T.2
Mayo, R.N.3
Scott, W.S.4
Taylor, G.S.5
-
6
-
-
0029519794
-
The triptych FPGA architecture
-
Boriello, G., Ebeling, C., Haucks, S. and Burns, S., "The triptych FPGA architecture." IEEE Transaction on VLSI Systems 3(4) pp. 491-501, 1991.
-
(1991)
IEEE Transaction on VLSI Systems
, vol.3
, Issue.4
, pp. 491-501
-
-
Boriello, G.1
Ebeling, C.2
Haucks, S.3
Burns, S.4
-
7
-
-
33746899134
-
Rothko: A three dimensional FPGA architecture, its fabrication, and design tools
-
Leeser, M., Meleis, W. M., Vai, M. M. and Zavracky, P., "Rothko: A three dimensional FPGA architecture, its fabrication, and design tools." Seventh International Workshop on Field Programmable Logic and Applications, September 1997.
-
Seventh International Workshop on Field Programmable Logic and Applications, September 1997
-
-
Leeser, M.1
Meleis, W.M.2
Vai, M.M.3
Zavracky, P.4
-
8
-
-
4243879730
-
System-level performance evaluation of three-dimensional integrated circuits
-
Ph.D. Dissertation, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, January
-
Rahman, A., "System-level performance evaluation of three-dimensional integrated circuits." Ph.D. Dissertation, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, January 2001.
-
(2001)
-
-
Rahman, A.1
-
9
-
-
0029510886
-
Three-dimensional field-programmable gate arrays
-
September
-
Alexander, M., Cohoon, J., Colflesh, J., Karro, J. and Robins, G., "Three-dimensional Field-programmable Gate Arrays," in Proceedings of IEEE International ASIC Conference, pp. 253-256, September 1995.
-
(1995)
Proceedings of IEEE International ASIC Conference
, pp. 253-256
-
-
Alexander, M.1
Cohoon, J.2
Colflesh, J.3
Karro, J.4
Robins, G.5
-
10
-
-
0043248417
-
ERNI-3D: A technology-generic tool for interconnect reliability projections in 3D integrated circuits
-
Master of Science Thesis. Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science
-
Alam, S. M., "ERNI-3D: A technology-generic tool for interconnect reliability projections in 3D integrated circuits." Master of Science Thesis. Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science.
-
-
-
Alam, S.M.1
-
11
-
-
0032659110
-
Methodology for electromigration critical thereshold design rule checking
-
Clement, J. J., Riege, S. P., Cvijetic, R. and Thompson, C. V., "Methodology for electromigration critical thereshold design rule checking." IEEE Transactions on CAD 18, p. 576, 1999.
-
(1999)
IEEE Transactions on CAD
, vol.18
, pp. 576
-
-
Clement, J.J.1
Riege, S.P.2
Cvijetic, R.3
Thompson, C.V.4
-
12
-
-
0032187955
-
A hierarchical reliability analysis for circuit design evaluation
-
Riege, S. P., Thompson, C. V. and Clement, J. J., "A hierarchical reliability analysis for circuit design evaluation." IEEE Transactions on ED 45, p. 2254, 1998.
-
(1998)
IEEE Transactions on ED
, vol.45
, pp. 2254
-
-
Riege, S.P.1
Thompson, C.V.2
Clement, J.J.3
-
13
-
-
33244495170
-
Failures plague 130-nanometer IC processes
-
EE Times; Siliconstrategies.com, August 26
-
Wilson, R., EE Times, "Failures plague 130-nanometer IC processes," Siliconstrategies.com, August 26, 2002, http://www.siliconstrategies.com/story/OEG20020826S0022
-
(2002)
-
-
Wilson, R.1
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