메뉴 건너뛰기




Volumn 35, Issue 2-3, 2003, Pages 199-206

Layout-specific circuit evaluation in 3-D integrated circuits

Author keywords

3 D integrated circuits; FPGA; IC performance comparison; Layout methodology; Reliability

Indexed keywords

COMPUTER AIDED DESIGN; FIELD PROGRAMMABLE GATE ARRAYS; INTEGRATED CIRCUIT LAYOUT; INTEGRATING CIRCUITS; LINEAR INTEGRATED CIRCUITS; SILICON WAFERS; THREE DIMENSIONAL; TWO DIMENSIONAL;

EID: 0041848636     PISSN: 09251030     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1024190918668     Document Type: Article
Times cited : (7)

References (13)
  • 2
    • 85013949634 scopus 로고    scopus 로고
    • Wire-length distribution of three-dimensional integrated circuits
    • Rahman, A., Fan, A., Chung, J. and Reif, R., "Wire-length distribution of three-dimensional integrated circuits," in Proceedings of IITC, pp. 233-235, 1999.
    • (1999) Proceedings of IITC , pp. 233-235
    • Rahman, A.1    Fan, A.2    Chung, J.3    Reif, R.4
  • 3
    • 33646125223 scopus 로고    scopus 로고
    • Interconnect performance modeling for 3D integrated circuits with multiple Si layers
    • Souri, S. J. and Saraswat, K. C., "Interconnect performance modeling for 3D integrated circuits with multiple Si layers," in Proceedings of IITC, pp. 24-26, 1999.
    • (1999) Proceedings of IITC , pp. 24-26
    • Souri, S.J.1    Saraswat, K.C.2
  • 8
    • 4243879730 scopus 로고    scopus 로고
    • System-level performance evaluation of three-dimensional integrated circuits
    • Ph.D. Dissertation, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, January
    • Rahman, A., "System-level performance evaluation of three-dimensional integrated circuits." Ph.D. Dissertation, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, January 2001.
    • (2001)
    • Rahman, A.1
  • 10
    • 0043248417 scopus 로고    scopus 로고
    • ERNI-3D: A technology-generic tool for interconnect reliability projections in 3D integrated circuits
    • Master of Science Thesis. Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science
    • Alam, S. M., "ERNI-3D: A technology-generic tool for interconnect reliability projections in 3D integrated circuits." Master of Science Thesis. Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science.
    • Alam, S.M.1
  • 11
    • 0032659110 scopus 로고    scopus 로고
    • Methodology for electromigration critical thereshold design rule checking
    • Clement, J. J., Riege, S. P., Cvijetic, R. and Thompson, C. V., "Methodology for electromigration critical thereshold design rule checking." IEEE Transactions on CAD 18, p. 576, 1999.
    • (1999) IEEE Transactions on CAD , vol.18 , pp. 576
    • Clement, J.J.1    Riege, S.P.2    Cvijetic, R.3    Thompson, C.V.4
  • 12
    • 0032187955 scopus 로고    scopus 로고
    • A hierarchical reliability analysis for circuit design evaluation
    • Riege, S. P., Thompson, C. V. and Clement, J. J., "A hierarchical reliability analysis for circuit design evaluation." IEEE Transactions on ED 45, p. 2254, 1998.
    • (1998) IEEE Transactions on ED , vol.45 , pp. 2254
    • Riege, S.P.1    Thompson, C.V.2    Clement, J.J.3
  • 13
    • 33244495170 scopus 로고    scopus 로고
    • Failures plague 130-nanometer IC processes
    • EE Times; Siliconstrategies.com, August 26
    • Wilson, R., EE Times, "Failures plague 130-nanometer IC processes," Siliconstrategies.com, August 26, 2002, http://www.siliconstrategies.com/story/OEG20020826S0022
    • (2002)
    • Wilson, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.