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Volumn 784, Issue , 2003, Pages 29-34
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Residual stress effects in ferroelectric thin films
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL VAPOR DEPOSITION;
FERROELECTRIC MATERIALS;
GRAIN SIZE AND SHAPE;
INTERFACES (MATERIALS);
LITHOGRAPHY;
PERMITTIVITY;
RESIDUAL STRESSES;
TENSILE STRESS;
THERMAL EFFECTS;
COMPOSITIONAL CONTROLS;
INTERFACE EFFECTS;
THIN FILM DEPOSITION;
THIN FILMS;
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EID: 2942655439
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-784-c3.2 Document Type: Conference Paper |
Times cited : (2)
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References (18)
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