Fluorine plasma chemistry for high-AR dielectric etching

Solid State Technology

Volumn 48, Issue 11, 2005, Pages

  Ji, Bing ^a   Motika, Stephen A ^a,b   Badowski, Peter R ^a,b   Dheandhanoo, Seksan ^a,b   Stets, James R ^a,b   Karwacki, Eugene J ^a  

^a AIR PRODUCTS AND CHEMICALS INC   (United States)

^b Air Products and Chemicals ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC ETCHING; ETCH MOLECULES; PLASMA CHEMISTRY;

ASPECT RATIO; DIELECTRIC PROPERTIES; FLUORINE COMPOUNDS; PLASTIC FILMS; SATURATION (MATERIALS COMPOSITION);

PLASMA ETCHING;

EID: 29144475558     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (12)

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