Methods of piezo-spectroscopic calibration of thin film materials: II. Tensile stress field at indentation crack tip

Measurement Science and Technology

Volumn 17, Issue 1, 2006, Pages 191-198

  Zhu, Wenliang ^a   Wan, Keshu ^a   Pezzotti, Giuseppe ^a  

^a KYOTO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Indentation crack; Piezo spectroscopy; Stress evaluation; Thin film

Indexed keywords

BENDING STRENGTH; CRACK INITIATION; JIGS; PIEZOELECTRICITY; SCANNING ELECTRON MICROSCOPY; SPECTROSCOPIC ANALYSIS; STRESS ANALYSIS;

INDENTATION CRACK; PIEZO-SPECTROSCOPY; STRESS EVALUATION; STRESS FIELD;

THIN FILMS;

PIEZOELECTRICITY;

EID: 29144448064     PISSN: 09570233     EISSN: 13616501     Source Type: Journal    
DOI: 10.1088/0957-0233/17/1/030     Document Type: Conference Paper

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