Lattice defect investigation of ECAP-Cu by means of X-ray line profile analysis, calorimetry and electrical resistometry

Materials Science and Engineering: A

Volumn 410-411, Issue , 2005, Pages 169-173

  Schafler, E ^a   Steiner, G ^a   Korznikova, E ^a   Kerber, M ^a   Zehetbauer, M J ^a  

^a UNIVERSITY OF VIENNA   (Austria)

Author keywords

Deformation induced vacancies; Lattice defect annealing; Nanostructures; Severe plastic deformation

Indexed keywords

ANNEALING; CRYSTAL DEFECTS; CRYSTAL LATTICES; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY OF SOLIDS; METAL PRESSING; NANOSTRUCTURED MATERIALS; PLASTIC DEFORMATION; SHEAR STRESS; THERMAL EFFECTS; X RAY DIFFRACTION ANALYSIS;

DEFORMATION INDUCED VACANCIES; EQUAL CHANNEL ANGULAR PRESSING (ECAP); LATTICE DEFECT ANNEALING; RESIDUAL ELECTRICAL RESISTIVITY (RER); SEVERE PLASTIC DEFORMATION (SPD); X-RAY BRAGG PROFILE ANALYSES (XPA); X-RAY LINE PROFILE ANALYSIS;

COPPER;

PLASTIC DEFORMATION;

EID: 28944437790     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.08.070     Document Type: Article

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