Impression creep testing and microstructurally adaptive creep modeling of lead free solder interconnects

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 641-647

  Dutta, I ^a   Pan, D ^a   Jadhav, S ^b  

^a Naval Postgraduate School ^*  (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP BEHAVIOR; MICROELECTRONIC PACKAGE; SOLDER JOINTS; THERMOMECHANICAL FATIGUE;

CREEP TESTING; FATIGUE OF MATERIALS; INTERMETALLICS; MATHEMATICAL MODELS; MICROSTRUCTURE; SOLDERING;

MICROELECTRONICS;

EID: 33745712110     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502881     Document Type: Conference Paper

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