Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects

Materials Research Society Symposium Proceedings

Volumn 863, Issue , 2005, Pages 265-270

  Li, Yunlong ^a,b   Tökei, Zsolt ^a   Mandrekar, Tushar ^c   Mebarki, Bencherki ^c   Groeseneken, Guido ^a,b   Maex, Karen ^a,b  

^a IMEC   (Belgium)

^b Katholieke Universiteit Leuven   (Belgium)

^c APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT VOLTAGE CHARACTERISTICS; DIELECTRIC MATERIALS; DIFFUSION; LARGE SCALE SYSTEMS; ORGANOMETALLICS; SILICA;

BARRIER TREATMENTS; DIELECTRIC RELIABILITY; ORGANO-SILICA-GLASS (OSG) INTERCONNECTS;

COPPER;

EID: 28844463109     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-863-b4.4     Document Type: Conference Paper

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