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Volumn 863, Issue , 2005, Pages 227-232

Thermal oxidation of Cu interconnects capped with CoWP

Author keywords

[No Author keywords available]

Indexed keywords

COBALT COMPOUNDS; DIELECTRIC MATERIALS; INTERCONNECTION NETWORKS; OXIDATION; OXIDES;

CU INTERCONNECTS; DIELECTRIC BARRIER; THERMAL OXIDATION;

COPPER;

EID: 28844452556 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: 10.1557/proc-863-b6.11 Document Type: Conference Paper

Times cited : (4)

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