Investigation on the thermal distribution of nMOSFETs under different operation modes by scanning thermal microscopy

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2005, Pages 294-299

  Hendarto, E ^a   Altes, A ^b   Heiderhoff, R ^b   Phang, J C H ^a   Balk, L J ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b UNIVERSITY OF WUPPERTAL   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

GATE CHANNELS; SCANNING THERMAL MICROSCOPES (STHM); THERMAL DISTRIBUTION; THERMAL WAVE PROPAGATION;

ELECTRIC BREAKDOWN; ELECTRIC RESISTANCE; ELECTRIC VARIABLES MEASUREMENT; GATES (TRANSISTOR); SCANNING TUNNELING MICROSCOPY; WAVE PROPAGATION;

MOSFET DEVICES;

EID: 28744446596     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Semiconductor Industry Association, "International Technology Roadmap for Semiconductors," 2004 Edition, http://public.itrs.net/
2. L.J. Balk, M. Maywald, R.J. Pylkki, "Nanoscopic Detection of the Thermal Conductivity of Compound Semiconductor Materials by Enhanced Scanning Thermal Microscopy," in Inst Phys Conf Ser, No 146, 1995, pp. 655-658.
3. G.B.M. Fiege, V. Feige, J.C.H. Phang, M. Maywald, S. Goerlich, L.J. Balk, "Failure Analysis of Integrated Devices by Scanning Thermal Microscopy (SThM)," Microelectronics Reliability, Vol 38, No 6-8, 1998, pp. 957-961.
4. N. Arora, "MOSFET Models for VLSI Circuit Simulation: Theory and Practice," Springer-Verlag, 1993.
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7. M. Li, Y.B. Gianchandani, "Microcalorimetry Applications of a Surface Micromachined Bolometer-type Thermal Probe," Journal of Vacuum Science & Technology B, Vol 18, No 6, 2000. pp. 3600-3603.
8. M. Li, J.H. Lee, F. Cerrina, A.K. Menon, Y.B. Gianchandani, "Chemical and Biological Diagnostics using a Micromachined Polyimide-shank Scanning Bolometer Probe," in Solid State Sensors, Actuators and Microsystems Workshop, Hilton Head Island, South Carolina, USA, 2002, pp. 235-238.
9. M. Palaniappan, G.B.M. Fiege, V. Ng, R. Heiderhoff, J.C.H. Phang, L.J. Balk, "Correlation of Thermal and Electrical Properties of a Short Channel nMOSFET," in Proc Int Symp Testing & Failure Analysis (ISTFA 1999), 14-18 Nov 99, Santa Clara, California, USA, 1999, pp. 465-470.
10. T.H. Lee, G.B.M. Fiege, A. Altes, G. Zimmermann, V. Ng, R. Heiderhoff, J.C.H. Phang, L.J. Balk, "Characterization of MOS Devices by Scanning Thermal Microscopy (SThM)," in Proc Int Symp Testing & Failure Analysis (ISTFA 2001), 11-15 Nov 2001. Santa Clara, California, USA, 2001, pp. 191-197.
11. R. Ostermeir, K. Brunner, G. Abstreiter, W. Weber, "Temperature Distribution in Si-MOSFET's Studied by Micro Raman Spectroscopy," IEEE Trans Electron Devices, Vol 39, No 4, 1992, pp. 858-863.