Scanning near field thermal microscopy on a micromachined thin membrane

Superlattices and Microstructures

Volumn 35, Issue 3-6, 2004, Pages 465-476

  Altes, A ^a   Mutamba, K ^b   Heiderhoff, R ^a   Hartnagel, H L ^b   Balk, L J ^a  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

3 method; SThM; Temperature; Thermal conductivity; Thin films; Wave propagation

Indexed keywords

DOPING (ADDITIVES); GALLIUM COMPOUNDS; MEMBRANES; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SEMICONDUCTOR DEVICES; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY; THERMAL DIFFUSION; THIN FILMS; WAVE PROPAGATION;

MICROELECTROMECHANCAL SYSTEMS (MEMS); SCANNING THERMAL MICROSCOPE (STHM); SEMICONDUCTOR MEMBRANES; STHM;

SUPERLATTICES;

EID: 1842498063     PISSN: 07496036     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.spmi.2003.09.008     Document Type: Conference Paper

References (14)

1. Meinders E.R. Measurement of the thermal conductivity of thin layers using a scanning thermal microscope. J. Mater. Res. 16:(9):2001;2530-2543.
2. Atluri V.P., Mahajan R.V., Patel P.R., Mallik D., Tang J., Wakharkar V.S., Chrysler G.M., Chiu C.P., Choksi G.N., Viswanath R.S. Critical aspects of high-performance microprocessor packaging. MRS Bull. 28:(1):2003;21-34.
3. Baltes H., Paul O., Brand O. Micromachined thermally based CMOS microsensors. Proceedings of the IEEE. 86:1998;1660-1678.
4. Meijer G.C.M., Van Herwaarden A.W. Thermal Sensors. 1994;Institute of Physics Publishing.
5. Mutamba K., Beilenhoff K., Megej A., Dörner R., Genc E., Fleckenstein A., Heyman P., Dickmann J., Woelk C., Hartnagel H.L. Micromachined 60 GHz GaAs power sensor with integrated receiving antenna. IEEE MTT-S International Microwave Symposium Digest (Cat. No. 01CH37157). vol. 3:2001;2235-2238.
6. Fiege G.B.M., Feige V., Phang J.C.H., Maywald M., Görlich S., Balk L.J. Failure analysis of integrated devices by scanning thermal microscopy (SThM). Microelectron-Reliab. 38:(6-8):1998;957-961.
7. Fiege G.B.M., Altes A., Heiderhoff R., Balk L.J. Quantitative thermal conductivity measurements with nanometer resolution. J. Phys. D: Appl. Phys. 32:1999;L13-L17.
8. Buzin A.I., Kamasa P., Pyda M., Wunderlich B. Application of a Wollaston wire probe for quantitative thermal analysis. Thermochim. Acta. 381:2002;9-18.
9. Holman J.P. Heat Transfer. 1972;McGraw-Hill Kogakusha Ltd, Tokyo. (Chapters 2-6).
10. Visser E.P., Versteegen E.H., Van Enckevort W.J.P. Measurement of thermal diffusivity in thin films using a modulated laser technique: application to CVD diamond films. J. Appl. Phys. 71:1991;3238-3248.
11. Cahill D.G. Thermal conductivity measurement from 30 to 750 K: the 3ω -method. Rev. Sci. Instrum. 61:(2):1990;802-808.
12. Tzou D.Y. Macro- to Microscale Heat Transfer. 1997;Taylor & Francis. (Chapter 1.6).
13. xAs. J. Appl. Phys. 57:1985;5330-5335.
14. Lee T.H., Fiege G.B.M., Altes A., Zimmermann G., Ng V., Heiderhoff R., Phang J.C.H., Balk L.J. Characterization of MOS devices by scanning thermal microscopy (SThM). Proceedings of the 28th International Symposium for Testing and Failure Analysis. ISTFA, Santa Clara, CA, USA, November 11-15: 2001;191-197. ISBN: 0-87170-746-2.