ECPR (Electrochemical Pattern Replication) Metal printing for advanced packaging applications

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 294-297

  Möller, Patrik ^a   Pelzer, Rainer ^b   Fredenberg, Mikael ^a   Wiwen Nilsson, Peter ^a   Karlsson, Lars ^a   Lee, Dennis ^c  

^a Replisaurus Technologies AB   (Sweden)

^b EV GROUP   (Austria)

^c MicroFab Technology (S) Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

METALLIZING; MICROSTRUCTURE; POLYIMIDES; SUBSTRATES;

CONDUCTING MATERIALS; ELECTROCHEMICAL PATTERN REPLICATION (ECPR);

ELECTRONICS PACKAGING;

EID: 28444435952     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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