Reliability challenges accompanied with interconnect downscaling and ultra low-k dielectrics

Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC

Volumn , Issue , 2005, Pages 85-87

  Hoofman, R J O M ^a   Michelon, J ^a   Bancken, P H L ^a   Daamen, R ^a   Verheijden, G J A M ^a   Arnal, V ^b   Hinsinger, O ^b   Gosset, L G ^c   Humbert, A ^c   Besling, W F A ^c   Goldberg, C ^d   Fox, R ^d   Michaelson, L ^d   Guedj, C ^e   Guillaumond, J F ^b,e   Jousseaume, V ^e   Arnaud, L ^e   Gravesteijn, D J ^a   Torres, J ^b   Passemard, G ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b STMICROELECTRONICS   (France)

^c NXP SEMICONDUCTORS   (Netherlands)

^d FREESCALE SEMICONDUCTOR INC   (United States)

^e CEA GRENOBLE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; OPTIMIZATION; PERFORMANCE; POROSITY; POTASSIUM; RELIABILITY;

DIELECTRIC SPACINGS; INTERCONNECT RELIABILITY; LOW-K MATERIALS;

LARGE SCALE SYSTEMS;

EID: 28244484898     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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