Investigation of an advanced SiH4 based self-aligned barrier process for Cu BEOL reliability performance improvement on industrial 110 nm technology

Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC

Volumn , Issue , 2005, Pages 132-134

  Dumont Girard, P ^a   Gosset, L G ^b   Chhun, S ^b   Juhel, M ^a   Girault, V ^a   Bryce, G ^b   Prindle, C ^c   Torres, J ^a  

^a STMICROELECTRONICS   (France)

^b NXP SEMICONDUCTORS   (Netherlands)

^c FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIELECTRIC PROPERTIES; ELECTROMIGRATION; RELIABILITY; STABILIZATION;

CAPPING LAYER; DIELECTRIC BARRIERS; ELECTRICAL PERFORMANCE;

SILICON COMPOUNDS;

EID: 28244463246     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. C. Bermond, B. Fléchet, A. Farcy, V. Arnal, J. Torres, G. Le Carval, G. Angénieux, R. Salik, Proceedings of the 2002 International Interconnect Technology Conference, p. 161-163 (2002)
2. L.G. Gosset, V. Arnal, C. Prindle, R. Hoofman, G. Verheijden, R. Daamen, L. Broussous, F. Fusalba, M. Assous, R. Chatterjee, J. Torres, D. Gravesteijn, K.C. Yu, Proceedings of the 2003 IITC, p. 65-67 (2003)
3. K. Goto, H. Yuasa, A. Andatsu, M. Matsuura, Proceedings of the 2003 IITC, p. 6-8 (2003)
4. Y. Shacham-Diamand, Y. Sverdlov, N. Petrov, Journal of the Electrochemical Society 148, p. C162-C167 (2001)
5. C.-K. Lu, L. Gignac, R. Rosenberg, E. Liniger, J. Rubino, C. Sambucetti, A. Domenicucci, X. Chen, A.K. Stamper, Applied Physics Letters 81, p. 1782 (2002)
6. T. Ko, C.L. Chang, S.W. Chou, M.W. Lin, C.J. Lin, C.H. Shih, S.H. Su, M.H. Tsai, W.S. Shue, M.S. Liang, Digest of Technical Papers of 2003 Symposium on VLSI Technology, p. 106-110 (2003)
7. E.G. Colgan, Thin Solid Films 262, p. 120-123 (1995)
8. H. Ashihara, K. Ishikawa, T. Oshima, K. Sasajima, N. Konishi, S. Uno, K. Tsugane, T. Iwasaki, T. Saito, Proceedings of the 2003 Advanced Metallization Conference, p.589-594 (2004)
9. T. Takewaki, T. Ohmi, T. Nitta, Digest of Technical Papers of 1995 Symposium on VLSI Technology, p. 31 (1995)
10. L.G. Gosset, V. Arnal, S. Chhun, N. Casanova, M. Mellier, J.-Ph. Reynard, X. Federspiel, J.-F. Guillaumond, L. Arnaud, J. Torres, Proceeding of 2003 AMC, p. 321-328 (2004)
11. S. Chhun, L.G. Gosset, N. Casanova, J.-F. Guillaumond, P. Dumont-Girard, X. Federspiel, R. Pantel, V.Arnal, J. Torres, Microelectronic Engineering 76, p. 106-112 (2004)
12. P. Murarka and S. W. Hymes, Critical Reviews in Solid State and Material Sciences 20 (2), p. 87-124 (1995)