Thermal stability of Ni(Pt) silicide films formed on poly-Si

Microelectronic Engineering

Volumn 82, Issue 3-4 SPEC. ISS., 2005, Pages 485-491

  Doi, I ^a   Teixeira, R C ^a   Santos, R E ^a   Diniz, J A ^a   Swart, J W ^a   Santos Filho, S G ^b  

^a UNIVERSITY OF CAMPINAS   (Brazil)

^b UNIVERSITY OF SÃO PAULO   (Brazil)

Author keywords

Morphology degradation; Ni(Pt)Si; Polycide; Sheet resistance; Silicides; Thermal stability

Indexed keywords

DEGRADATION; ELECTRIC RESISTANCE; HEAT TREATMENT; MORPHOLOGY; PLATINUM; POLYSILICON; TEMPERATURE DISTRIBUTION; THERMODYNAMIC STABILITY; THIN FILMS;

MORPHOLOGY DEGRADATION; NI(PT)SI; POLYCIDE; SHEET RESISTANCE; SILICIDES;

NICKEL COMPOUNDS;

EID: 28044469664     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.07.047     Document Type: Conference Paper

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