SCOPUS 정보 검색 플랫폼

Microelectronic Engineering

Volumn 82, Issue 3-4 SPEC. ISS., 2005, Pages 368-373

Mechanical characterization of low-k and barrier dielectric thin films

(7) Cherault N a,c Carlotti, G d Casanova, N a Gergaud, P e Goldberg, C b Thomas, O e Verdier, M f

a STMICROELECTRONICS (France)

b FREESCALE SEMICONDUCTOR INC (United States)

c PSL RESEARCH UNIVERSITY (France)

d UNIVERSITY OF PERUGIA (Italy)

e CNRS (France)

f UNIV GRENOBLE ALPES (France)

Author keywords

Coefficient of thermal expansion; Elastic modulus; Low k dielectric; Mechanical properties; Poisson's ratio

Indexed keywords

ELASTIC MODULI; HARDNESS; INDENTATION; MECHANICAL PROPERTIES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POISSON RATIO; SILICATES; THERMOMECHANICAL TREATMENT; THIN FILMS;

COEFFICIENT OF THERMAL EXPANSION; LOW-K DIELECTRICS; MECHANICAL RELIABILITY;

DIELECTRIC MATERIALS;

EID: 28044457911 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2005.07.018 Document Type: Conference Paper

Times cited : (31)

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