Process design for transfer moulding of electronic packages using a case-based reasoning approach with fuzzy regression adaptation

International Journal of Computer Integrated Manufacturing

Volumn 18, Issue 1, 2005, Pages 27-40

  Tong, K W ^a   Kwong, C K ^a   Chan, C Y ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

FUZZY SETS; LOGIC PROGRAMMING; PARAMETER ESTIMATION; REGRESSION ANALYSIS;

CASE-BASED REASONING (CBR); PARAMETER SETTINGS; TRANSFER MOULDING;

ELECTRONIC EQUIPMENT;

EID: 27844581153     PISSN: 0951192X     EISSN: 13623052     Source Type: Journal    
DOI: 10.1080/09511920412331284771     Document Type: Article

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